Partager l'article ! Packaging Reliability: You refined by: Subject: Components, Circuits, Devices & Systems ,   ...
| Février 2012 | ||||||||||
| L | M | M | J | V | S | D | ||||
| 1 | 2 | 3 | 4 | 5 | ||||||
| 6 | 7 | 8 | 9 | 10 | 11 | 12 | ||||
| 13 | 14 | 15 | 16 | 17 | 18 | 19 | ||||
| 20 | 21 | 22 | 23 | 24 | 25 | 26 | ||||
| 27 | 28 | 29 | ||||||||
|
||||||||||
You refined by:
Thermo-Mechanical Reliability Analysis of Package-on-Package Assembly
Comparison of LED Package Reliability under Thermal Cycling and Thermal Shock Conditions by Experimental Testing and Finite Element Simulation
Processing and Reliability Analysis of Flip-Chips with Solder Bumps Down to 30 μm Diameter